Advanced Packaging for US Market – CHIPS ACT Microelectronics Commons NORDTECH Hub
July 31, 2024, Plasma-Therm LLC, a leading manufacturer of plasma-process equipment for the Silicon Semiconductor, Compound Semiconductor and Advanced Packaging markets, announced the sale of an MDS-100 Plasma Dicing system to the Cornell NanoScale Science and Technology Facility (CNF). CNF is an open user facility for micro and nanofabrication at Cornell University in Ithaca, NY. The Plasma-Therm MDS-100 system will provide CNF users with innovative die singulation for Advanced Packaging. CNF purchased the platform with funding from The Northeast Regional Defense Technology Hub (NORDTECH), a research and innovation hub that is part of the U.S. Microelectronics Commons program. The MDS-100 platform will be available to all CNF users.
The MDS-100 platform offers industry-leading plasma dicing-on-tape capabilities for wafer sizes up to 200mm in a flexible, small-footprint configuration, and suited for process R&D, pilot line, and volume production requirements.
“We’re delighted to share the news that the MDS-100 has been added to our product suite used by CNF. We understand the importance of staying ahead in the emerging Advanced Packaging space, and we’re committed to supporting Cornell in any way we can. Looking forward to continuing our long-term collaboration and making a positive impact together,” says Plasma-Therm CEO Abdul Lateef.
MDS-100 – Ninth Addition to Plasma-Therm Product Suite at CNF
The MDS-100 will be the ninth addition to the Plasma-Therm product suite at CNF. This innovative die singulation process will enable the separation of individual chips from a larger wafer, allowing for greater precision and efficiency during the packaging and assembly stages of microelectronics manufacturing. The development of this technology is a significant step forward in the industry and represents CNF’s commitment to advancing the field of microelectronics through cutting-edge research and development.
“We are thrilled with the inclusion of Plasma-Therm’s plasma dicing technology development in our flexible open-use facility. The addition of the MDS-100 Plasma Dicing system will bring advanced device die singulation to our nanotechnology infrastructure and expertise,” says CNF Director of Operations Ron Olson.
About Plasma-Therm
Plasma-Therm is a global manufacturer of advanced plasma processing equipment. Its tools and processes are used to support manufacturing needs in etch, deposition, rapid thermal processing, and plasma-dicing technologies. The company serves the semiconductor and compound semiconductor industries in developing solutions for the wireless, power device, MEMS, photonics, advanced packaging, and data storage markets. With locations in North America, Europe and Asia-Pacific, Plasma-Therm meets the diverse needs of its customers with exceptional customer service. To learn more, visit www.plasmatherm.com.
About the Cornell NanoScale Science and Technology Facility (CNF)
The Cornell NanoScale Science and Technology Facility (CNF) is a world-class open user facility for micro- and nanofabrication. CNF’s staff of scientists and technicians assist users who range in experience from novices to nanotechnology experts, including undergraduates, graduate students, postdocs, and professionals. CNF staff are experienced at supporting university research and product development for companies of every size and stage of development. Flexible equipment and policies allow users to undertake projects that would not be possible in many other nanofabrication environments. CNF is a member of the National Nanotechnology Coordinated Infrastructure (NNCI) supported by the National Science Foundation (NSF). To learn more, visit https://www.cnf.cornell.edu/.
