Physical vapor deposition (PVD) sputtering provides a reliable, reproducible, clean thin-film deposition approach. Using plasma and the appropriate targets, it creates films that are used for diverse applications. These include contacts and interconnects for frontside and backside metallization, piezoelectric films such as aluminum nitride (AlN) for RF filters, and films for quantum computing.

While the plasma in PVD is like  the plasma used for etching, in magnetron PVD systems ions are directed toward a target instead of the substrate. In response, the target ejects material that is destined for the substrate. Film properties are controlled with plasma power, target and substrate bias, pressure, and substrate temperature. The capability to add reactive gases gives the technology another dimension. 

OUR PVD PRODUCTS

Endeavor™

Eclipse™

Ion beam deposition (IBD) provides control and repeatability for depositing a broad range of materials from dielectrics to metals, and everything in between. With such capability, the applications are extensive and include films for optics (antireflection coatings, filters, mirrors) and critical films for nonvolatile memory devices (MRAM) and magnetic transducers (thin-film read/write heads). With multiple targets, a complex film stack with angstrom-scale thick layers is possible.

The heart of the system is like ion beam etching: a plasma-driven ion source (usually driven inductively) with the Ar ions extracted and accelerated through a series of biased grids that can gently focus the beam. In IBD, the ions physically sputter material from a target to deposit it on the substrate. As with IBE, the substrate can be tilted and rotated for added flexibility. Ion-assisted deposition, where a second ion beam source is directed at the substrate where the film is being deposited, is a valuable optional capability. This makes it possible to influence film properties and even pattern structures using the tilt and rotate parameters. This multitude of features makes IBD a power approach to thin-film deposition.

OUR IBD PRODUCTS

VERSALINE®

QuaZar™

At the intersection of ALD and CVD deposition methodologies, F.A.S.T. represents a cross between the two. Using liquid precursor vaporizers, a dual-channel gas delivery showerhead, and a capacitively coupled plasma generation configuration, films can be deposited with characteristics of both ALD and CVD. This produces conformal, ALD-like films at speeds more closely aligned to CVD. While it’s not for every application, F.A.S.T. is particularly suited for thicker films that ALD struggles with due to ALD’s slow deposition rate and films that do not require ALD’s level of conformality. With F.A.S.T. you get unique film properties, a best-in-class solution for thick and conformal layers, and ALD film performances at near-CVD speed. The result is a system with low cost of ownership.

OUR F.A.S.T. PRODUCTS

KOBUS™

Some like it hot, some like it not. With Plasma-Therm^®, you can have it both ways.

Our HDRF low temperature technology is proven for demanding applications. Remove photoresist and polymer residue without damaging your sensitive devices and complex structures – for optimal quality of Bosch-process devices.

OUR HDRF PRODUCTS

VERSALINE®

Odyssey

Rapid thermal processing (RTP) was originally developed for ion implantation and annealing. It has since been expanded to include oxidation, silicide formation, chemical vapor deposition (CVD), and other advanced applications. Important characteristics of an RTP system include having a wide range of heating rates with a high upper limit, careful temperature monitoring, and ambient environment control. These capabilities make sophisticated thermal processing possible. 

RTP is a widely used technique with applications beyond silicon, including gallium arsenide (GaAs), silicon carbide (SiC), and other substrate materials. 

OUR RTP PRODUCTS

Heatpulse™

On-tape, plasma-based die singulation is a fascinating way to approach die separation. It allows complete dicing of wafers of any thickness, especially thin and ultra-thin, on industry-standard tape frames after grinding. Plasma dicing on tape (PDOT) helps eliminate the rough edges left by blades and requires a much thinner cutting pathway than either blades or lasers. The key to PDOT is process selectivity and control, wafer and tape temperature management, and maintaining tape integrity. With a PDOT singulation system, streets can be narrower to allow more dies per wafer; dies are stronger, with no microcracking; and entire wafers are diced at once. PDOT is insensitive to shrinking die dimensions and increasing number of streets. 

OUR PDOT PRODUCTS

Singulator®