singulator tool for semiconductor manufacturing

SINGULATOR^® MDS-100^™, MDS-300^™

SINGULATOR PERFORMS PLASMA WAFER DICING ON INDUSTRY-STANDARD TAPE FRAMES.

Our Singulator® model MDS-100 and MDS-300 systems are the first volume-production-ready plasma singulation systems for plasma dicing on tape (PDOT™). Singulator systems deliver unique benefits compared with traditional dicing techniques, especially for thin and ultra-thin wafers. The Cortex^® control system provides a stable, user-friendly control interface designed for efficiency and productivity.

Solutions for
Highest throughput—up to 3,000 mm/s dicing speed equivalent
Smooth sidewalls (compared with traditional dicing approaches)
No chipping or cracking damage for improved die strength
Street dimensions as small as 10μm and smaller
Die shape flexibility (rounded corners, key shape, circular, hexagonal)
On-tape process extendibility to TSV reveal, wafer thinning, stress relief
Solutions for back metal and street clearing

Optimized handling for processing wafers on standard dicing tape with plastic or metal frames
High-power ICP for industry-leading etch rates
Substrate temperature control with backside helium and electrostatic clamping
Low-particulate processing environment
Loading configuration up to two cassettes each for tape frames
Continuous operation for 4-, 6-, and 8-inch wafers on 8-inch tape frames and 12-inch wafers on tape frames

Cortex control system
EndpointWorks® program
Laser interferometry
OES
System parameters

close up of singulator tool for semiconductor dicing

singulator tool for semiconductor dicing

CONTACT A PRODUCT SPECIALIST

NEED ASSISTANCE?

Let our experts help you customize our processes solutions for your applications.

CONTACT PLASMA-THERM

SINGULATOR® MDS-100™, MDS-300™

SINGULATOR PERFORMS PLASMA WAFER DICING ON INDUSTRY-STANDARD TAPE FRAMES.

CONTACT A PRODUCT SPECIALIST

NEED ASSISTANCE?

SINGULATOR^® MDS-100^™, MDS-300^™