VERSALINE RIE Process Solutions

 


VERSALINE RIE
VERSALINE ICP
VERSALINE DSE
VERSALINE PECVD
VERSALINE HDPCVD

 

VERSALINE® RIE

Plasma-Therm’s VERSALINE RIE systems are installed in a wide range of production capacity facilities - from R&D through high-volume production. VERSALINE RIE offers low maintenance and high versatility for multiple applications.

Substrate sizes are conveniently accommodated without ever needing hardware reconfiguration. For future upgradeability to ICP, a high conductance option is available.

Hardware

  • Simple, low-maintenance design
          - Flexible substrate bias options with 13.56 MHz and 40 MHz

  • Flexible and upgradeable handling
          - ML — direct manual loading (single or multi-substrate)
          - LL — single substrate or multi-substrate carrier loader
          - CX — cassette-to-cassette loading of wafers or carriers

  • Improved preventative maintenance cycles with thermally managed chamber liner and pump train

  • Digital MFCs with filtered and bypassed gas lines

  • Mag-Lev turbo pump

  • Efficient thermal management with monoblock electrode construction

  • Available substrate electrode temperature ranges –40ºC to 180ºC

  • Process specific electrode material

Endpoint

Integrated multifunctional endpoint capability with EndpointWorks

  • Laser Interferometry

  • OEI

  • OES

  • System Parameters

  • Custom inputs (e.g., RGA)

Software

  • User-friendly SEMI standard interface (E-95)

  • Comprehensive data logging

  • Automated cleaning program (AMS)

  • Real-time process data display

  • Fully integrated endpoint system

  • Factory automation compatible (SECS/GEM)

  • Edit recipes during runs

  • Multiple user access levels

  • Alarm history

Process

  • Tunable selectivity

  • Extensive process library

  • Wide process latitude

For more information, contact us at information@plasmatherm.com or at +1.727.577.4999

 
 
 
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