VERSALINE PECVD Technology for R&D and Production

VERSALINE Systems

VERSALINE ICP
VERSALINE DSE
VERSALINE RIE
VERSALINE PECVD
VERSALINE HDPCVD

 

VERSALINE® PECVD

Plasma-Therm’s VERSALINE PECVD is the result of decades of technological innovation. VERSALINE PECVD systems can deposit many different high-quality films, delivering maximum productivity with low total cost of ownership.

The parallel plate configuration of VERSALINE PECVD is designed to provide a clean processing environment and require little maintenance.

Hardware

  • Simple, low-maintenance chamber with reduced surface area and smooth contours for thorough, high-rate cleaning
  • Highly uniform fractal-based gas distribution
  • 13.56 MHz and dual frequencies available
  • Flexible and upgradeable handling configuration:
    • ML — direct manual loading
    • LL — single substrate or carrier loader
    • CX — cassette-to-cassette loading of wafers or carriers
  • High temperature electrode up to 350°C
  • Low particulate processing environment with thermally managed reactor design — up to 200°C for walls and showerhead

Endpoint

  • Integrated multifunctional endpoint capability with EndpointWorks
  • Unique OEI application for real-time film thickness and rate monitoring
  • OES for optimized chamber clean

Software

  • User-friendly SEMI standard interface (E-95)
  • Comprehensive data logging
  • Automated cleaning program (AMS)
  • Real-time process data display
  • Fully integrated endpoint system
  • Factory automation compatible (SECS/GEM)
  • Edit recipes during runs
  • Multiple user access levels
  • Alarm history

Process

  • Stress control
  • High uniformity
  • Low damage
  • Low particulates
  • Tunable index
  • Increased productivity with short clean cycles
  • Conformal SiNx films
  • Doping capability (loadlocked versions only)
  • Extensive process library

For more information, contact us at information@plasmatherm.com or at +1.727.577.4999

 
 
 
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