VERSALINE DSE provides leading deep silicon etch technology

 
 


VERSALINE RIE
VERSALINE ICP
VERSALINE DSE
VERSALINE PECVD
VERSALINE HDPCVD

 

VERSALINE® DSE

Plasma-Therm’s VERSALINE DSE provides profile control and side wall smoothness while utilizing award-winning fast process control. Outstanding flexibility and process latitude are offered as well as the highest selectivities to mask material in the industry.

Hardware

In addition to all of the features and benefits available with the VERSALINE ICP, the VERSALINE DSE offers:

  • Profile control with parameter morphing (patented)
  • Smooth side wall with short process step times
    • - Fast Gas Switching (patented)
    • - Fast and stable pressure control (patented)
    • - Solid State RF Tuning
  • Notchless silicon-on-insulator etching (patent pending)
    • - Innovative RF bias waveform con
    • - Patented Endpoint algorithm techniques
  • Aspect Ratio Dependent Etching reduction (patent pending)
  • Process Stability (Temperature Stabilized ICP)

Endpoint

  • Integrated multifunctional endpoint capability with OES using EndpointWorks

Software

  • Patented morphing profile control
  • User-friendly SEMI standard interface (E-95)
  • Comprehensive data logging
  • Automated cleaning program (AMS)
  • Real-time process data display
  • Fully integrated endpoint system
  • Factory automation compatible (SECS/GEM)
  • Edit recipes during runs
  • Multiple user access levels
  • Alarm history

Process

  • High aspect ratios
  • Smooth sidewalls
  • High uniformity
  • High selectivity
  • Notchless SOI
  • Profile control
  • Optimized etch rates
  • ARDE reduction

Awards


MicroNano Award for "Most Innovative Technology"— VERSALINE Fast DSE Process Technology

For more information, contact us at information@plasmatherm.com or at +1.727.577.4999

 
 
 
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