MASK ETCHER® SYSTEMS

PLASMA-THERM’S® MASK ETCHER SYSTEMS SET DRY-ETCH PERFORMANCE AND FLEXIBILITY STANDARDS FOR PHOTOMASK PRODUCTION

Plasma-Therm pioneered dry etching for the highly specialized photomask market in 1998. Since then, our Mask Etcher solutions have been a key enabler of Moore’s Law. The Mask Etcher platform tracked with scaling nodes, and now, with our fifth-generation technology (Gen V), we are at the leading edge. Whether you’re using Cr, phase shift, or EUV mask materials, our Mask Etcher system is ready. Innovative technologies ensure excellent uniformity and particle control while also maintaining high system production uptime and yields.

Process
  • Compensation for uniformity and loading effect
  • Feature fidelity with low etch bias
  • Low particle and defect
  • Low line edge roughness (LER)
Hardware
  • Dedicated platform specifically built for the highly specialized photomask market
  • Dual ICP source and lateral adjustment technology
  • Upgrades available
  • Several front-end handling options:
    • Ballroom/bulkhead mounting
    • Automated load station (ALS) for Gen III
    • SMIF on automated front end (AFE) for Gen V
Control System
close up of mask etcher for semiconductor etching

mask etcher for semiconductor etching

control panel on mask etcher for semiconductor etching

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