Mask Etcher Generation V accommodates multiple process chambers and front-end options

 
 
 

Mask Etcher® Series

Plasma-Therm has pioneered dry etching for the highly specialized photomask market for more than 15 years. Mask Etcher® systems set dry etch performance and flexibility standards for photomask production. Plasma-Therm’s Mask Etcher® solution is a key enabler of Moore’s law and shrinking technology nodes.

A wide variety of films can be etched from entry level 250um technology to < 32nm production with ICP high density plasma etch systems.

Excellent uniformity and particle control are achieved through innovative technologies while maintaining high system production uptime. Plasma-Therm’s latest Generation V Mask Etcher excels in CD uniformity and linearity well below 5 nm.

Mask Etcher 2-V Evolution

 
Mask Etcher® Gen 2 Gen 3 Gen 4 GenV
Node (nm) 180 130-90 65-45 32-22
 

Hardware

  • Dedicated platform specifically built for the highly specialized photomask market
  • Several front-end handling options:
              - Ballroom/Bulkhead mounting
              - Automated load station (ALS)
              - SMIF on Automated Frond End (AFE)

Endpoint

Integrated multifunctional endpoint capability with EndpointWorks

  • Laser Interferometry
  • OES
  • System Parameters
  • Custom input (e.g. RGA)

Software

  • User friendly SEMI standard interface
  • Comprehensive data logging
  • Real-time process data display
  • Fully integrated endpoint system
  • Factory automation compatible (SECS/GEM)
  • Multiple user access levels
  • Alarm history

Process

  • Compensation for uniformity and loading effect
  • Low etch bias
  • Good feature fidelity
  • Low particle and defect
  • Low line edge roughness
  • Maximized productivity and low cost of ownership

For more information, contact us at information@plasmatherm.com or at +1.727.577.4999

 
 
 
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