Mask Etcher^® Series

Mask Etcher^® systems set dry etch performance and flexibility standards for photomask production. Plasma-Therm’s Mask Etcher^® solution is a key enabler of Moore’s law and shrinking technology nodes.

A wide variety of films can be etched from entry level 250um technology to < 32nm production with ICP high density plasma etch systems.

Excellent uniformity and particle control are achieved through innovative technologies while maintaining high system production uptime. Plasma-Therm’s latest Generation V Mask Etcher^® excels in CD uniformity and linearity well below 5 nm.

Mask Etcher^® 2-V Evolution

Hardware

• Dedicated platform specifically built for the highly specialized
  photomask market

• Several front-end handling options
            - Ballroom/Bulkhead mounting
            - Automated load station (ALS)
            - SMIF on Automated Frond End (AFE)

Endpoint
Integrated multifunctional endpoint capability with EndpointWorks

• Laser Interferometry

• OES

• System Parameters

• Custom input (e.g. RGA)

Software

• User friendly SEMI standard interface

• Comprehensive data logging

• Real-time process data display

• Fully integrated endpoint system

• Factory automation compatible (SECS/GEM)

• Multiple user access levels

• Alarm history

Process

• Compensation for uniformity and loading effect

• Low etch bias

• Good feature fidelity

• Low particle and defect

• Low line edge roughness

• Maximized productivity and low cost of ownership

For more information, contact us at information@plasmatherm.com or at +1.727.577.4999