At Plasma-Therm®, all our etch systems are founded in plasma-processing. Our plasma etching processes are more precise, cost effective, cleaner, and safer than wet etching. While wet etch processes use chemical etchants to remove materials, plasma etching converts gasses to plasma to selectively remove material. Plasma etching is used for semiconductor wafer processing, as well as in MEMS and compound semiconductor manufacturing. Performed under vacuum and often automated, We offer systems that perform the following plasma-etch processes:
ICP
When our inductively coupled plasma (ICP) technology is added to our reactive ion etching (RIE) system, you get higher etch rates, greater process flexibility and reduced ion bombardment for maximum process efficiency.
RIE
Plasma RIE etching is both efficient and gives you directional etching capability for maximum flexibility. RIE accommodates a wide range of materials.
DSE™
When a smooth surface, excellent selectivity and etch depths greater than 100 µm are your goal, than ICP-configured Deep Silicon Etching (DSE) is your process of choice.
IBE
When etch rate is less important than exacting profile control, ion beam etch (IBE) delivers. It offers you high precision for applications that demand targeted profile control.
ALE
Atomic Layer Etching (ALE) technology lets you control material removal from a substrate layer-by-layer, where the etch thickness is on the order of magnitude of a monolayer.
HDRF™
Our HDRF low temperature technology is proven for demanding applications. Remove photoresist and polymer residue without damaging your sensitive devices and complex structures – for optimal quality of Bosch-process devices.
EXPLORE ALL ETCH PRODUCTS
Find all our etch products, processes, capabilities, and brands here.
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Etch Product by Process Capabilities
Not sure which of our etch process tools is right for your applications? Use the table as your guide.
| * indicates products with Add-on options | ICP | RIE | DSE™ | IBE | HDRF™ | ALE |
|---|---|---|---|---|---|---|
| * VERSALINE® | ICP | RIE | DSE™ | IBE | HDRF™ | ALE |
| Tegal™ | RIE | |||||
| Mask Etcher® | ICP | |||||
| Odyssey | HDRF™ | |||||
| QuaZar™ | IBE |
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