Endeavor™ PVD System

The Endeavor system is a dual-cathode S-Gun™ magnetron providing state-of-the-art PVD films.

The Endeavor PVD system is used for sputtering thin, dense, highly uniform films for frontside and backside applications. Coatings are contamination-free and have low residual stress. The individually controlled dual target configuration is ideal for reactively sputtered films such as metal oxides and advanced piezoelectric materials.

Endeavor Legacy Systems We also support the legacy Endeavor AT and 8600 PVD cluster systems with spare parts, field service, and upgrades.

Reactively sputtered films (with N₂ or O₂)

Stress control (RF bias and SAU)
Piezoelectric films (e.g., AlN, ScAlN)
Backside and frontside metallization
Dielectric films (e.g., FiltersBragg Reflectors) with tiled target capability for stoichiometry adjustment

Single PM or cluster configuration (up to five process modules)
Sputter mode: DC or AC (independent target control)
Accommodates up to 200mm substrates
High utilization, unbonded targets for easy replacement
Up to 500°C processing

The Cortex® control system provides a stable, user-friendly control interface designed for efficiency and productivity. Cortex benefits include:

Graphical, SEMI-standard (E-95) interface
Comprehensive recipe editing and process parameter data logging and charting (real-time and post-processing)
Automated clean and conditioning routines with configurable triggers
Factory automation host interface (with optional SECS/GEM license)
User-level access control
Auto logging of alarms, jobs, calibration, and resource usage
Integrated with GLANCE™ data logging and visualization tool
Same feature-rich control system as used on high-volume production systems

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