"3D" integration of chips for thin-package modules is here, driven by worldwide demand for greener,
faster, smaller devices. At the same time, accelerating product development cycles place
tremendous pressure on chip designers and suppliers.
In this context, mid-end-of-line processing and packaging are the latest areas
seeking innovation to
meet the challenges of delivering more good devices, while coping with "More Moore" and
"More than Moore" roadmaps.
Plasma-Therm, in partnership with ON Semiconductor, has developed new, unique solutions
in wafer processing on industry-standard tape frames. Compared to mechanical and laser dicing, plasma
dicing offers numerous advantages:
- Smaller streets allowing more dies per wafer
- No lateral damage
- Reduced stress in package
- Whole wafers diced at once
Plasma processing also accommodates
wafer thinning for increased performance, energy saving, heat management, and 3D packaging.
Plasma-Therm Singulator® technology advantages
DESIGNERS can push the performance
envelope with thinner wafers, and maximize return using non-orthogonal die arrangements
and even non-orthogonal dies.
FRONT-END OPERATIONS increase
productivity and lower costs with reducied wafer starts by placing more
die per wafer.
BACKEND and PACKAGING maximize yield by eliminating lateral damage and
producing superior die strength compared
to laser and saw technology for die separation.
R&D programs reduce costs
with fast and secure singulation of limited numbers of high-value dies.
Typical applications of Singulator® plasma dicing
- Dicing of silicon, germanium, and GaAs substrates
- Stress relief
- Wafer thinning
- Through-silicon via (TSV) reveal
Full-thickness wafers or thinned wafers on carrier:
- TSV etch
- Stress-controlled PECVD films
- Dicing before grinding
- Failure analysis
Systems for advanced packaging applications
Plasma-Therm and Advanced Vacuum offer systems that are configurable for various requirements,
and settings, from R&D to pilot to production.
— The industry's first production-ready
plasma dicing platform
- VERSALINE® — Maximum flexibility
- Vision Series — Proven efficiency,
- Odyssey HDRF™ — No-damage PR
strip, cleaning, Bosch scallop removal
Contact us for more information.